08
2024
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08
Industry New Knowledge | DLP 3D Printing SiOC Ceramics Breakthrough in the Field of Microwave Absorption
Author:
Industry new knowledge
Recently, a team led by Quan Li from Nanjing Tech University published a study titled Multiscale design and digital light processing preparation of high-strength SiOC ceramic metastructures for tuning microwave absorption properties in Ceramics International.,High-strength silicon oxycarbide (SiOC) ceramic metamaterials were prepared by digital light processing (DLP)3D printing technology to regulate the microwave absorption properties. The results show the breakthrough of this new material in the field of microwave absorption.

Original link: https://www.sciencedirect.com/science/article/abs/pii/S0272884224010496
Adventure Technology official website: http://www.adventuretech.cn/
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research content
Microwave absorbing materials are of great significance for isolating electromagnetic radiation and reducing the radar cross section. Traditional manufacturing methods are difficult to achieve complex structural design, and DLP 3D printing technology provides new possibilities for the design and manufacture of high-performance microwave absorbing materials.The purpose of this paper is to develop a new type of solvent-free photosensitive polysiloxane pre-ceramic, and to prepare SiOC ceramic metamaterials with high strength and complex structure by DLP technology to achieve efficient microwave absorption performance.

△ Figure 1, schematic diagram of SiOC ceramic preparation route.

2, rheological properties of photosensitive ceramics. (a) viscosity, (B) shear stress.

3, FTIR spectra of the ceramic before and after curing.

△ Figure 4,(a) TG-DSC curve of S25 and main raw materials, (B) pyrolysis temperature curve of ceramics.

Figure 5, corresponding to the green body of different ceramic precursors and SiOC ceramic parts.

6,(a)x-ray diffraction pattern, and (b-d) Raman spectrum of pyrolized SiOC sample.

7,(a-c) microstructure of SiOC ceramics obtained from different pre-ceramics, (d) SiOC ceramic parts with complex structure,(e-j) polished cross-section and local enlargement of GS-TPMS structure.

8, (a) compressive strength, (B) strength-density Ashby plot of different SiOC ceramics.

9, dielectric properties of S20, S25 and S30 samples. (a)ε ′, (B) ε ″, (c) tan δ, (d) Zr.

10, Equivalent dielectric constant of SiOC ceramic structures with different porosity and pore structure. (a)εreff',(B) εreff',(c) tan delta,(d) Zr.

△ Figure 11, (a)S30-SiOC block, (B) GS-TPMS-20%,(c) GS-TPMS-51%,(d) GS-TPMS-67%,(e) honeycomb-51% with different porosity and pore structure
research conclusion
In this paper, an efficient solvent-free photosensitive polysiloxane pre-ceramic is developed, and a high-strength, complex structure SiOC ceramic metamaterial is prepared by DLP 3D printing technology, which achieves a major breakthrough in the field of microwave absorption.Optimized structural design and material composition significantly improve the electromagnetic properties and mechanical strength of the material. Future research will further optimize the material ratio and printing process to improve the performance and application potential of porous ceramic structures.
Through this research, SiOC ceramics show broad application prospects in the field of microwave absorption, and provide new ideas and methods for the development of a new generation of high-performance microwave absorption materials.
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